Depaneling systems

Asys Divisio routing, sawing and laser solutions for depaneling of PCBs.

Depaneling systems from Asys Divisio:

• Routing depaneling systems are perfect for cutting freeform contours, these systems seperate FR4, aluminium, and composite materials.
• Sawing depaneling systems are the most effective solution for long rectangular panels. These systems are separating prescores panels in perfection.
• Laser depaneling systems cut foil and rigid-flex easily. These systems are ultra-precise: very high precision while separatingon high and sensitive comnponents. Mastering even the most difficult contours.